What is the final step in the bonding and grounding surface preparation procedures?

The final step in bonding and grounding surface preparation procedures is to test electrical resistance. This step is crucial because it ensures that the bond created is effective and that there is a low-resistance path for the electrical current. Testing the electrical resistance verifies that the bond is capable of handling the operational currents without risking overheating or damage due to resistance buildup. This can be especially important in aviation applications, where reliability and safety are paramount.

Other activities, such as cleaning surfaces thoroughly, applying corrosion inhibitors, and securing connections, are important preparatory steps in the bonding and grounding process. However, they are performed prior to testing the resistance. By confirming the electrical resistance as the last action, technicians can be assured that the entire process has been completed correctly and that the surface preparation meets the required standards for optimal performance and safety.