What can thermal secondary breakdown lead to in power-sensitive components?

Thermal secondary breakdown in power-sensitive components typically refers to the phenomenon where a device becomes unstable due to excessive heat generated by increased operational stresses, particularly in semiconductor devices like transistors. When components operate at high temperatures, they can enter a state where the increase in current flow leads to further heating, creating a feedback loop that can cause the device to fail.

In this context, overheating is a direct and critical consequence of thermal secondary breakdown. As the temperature rises beyond the component’s rated limits, it may lead to physical damage at the junctions, alter material properties, and ultimately compromise the integrity of the component. This situation can degrade performance, result in failure, and necessitate repairs or replacements, emphasizing the importance of thermal management in electronic design and operation, particularly in avionics systems where reliability is paramount.

While the other outcomes, such as intermittent functioning or complete shutdown, may also occur as a result of overheating, the most immediate and fundamental issue arising from thermal secondary breakdown is overheating itself.